Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method

ABSTRACT

An apparatus for vacuum bonding a liquid crystal display device includes a unitary vacuum processing chamber, upper and lower stages provided at upper and lower spaces within the vacuum processing chamber for receiving first and second substrates, and at least one first substrate receiving system provided within the vacuum chamber to contact dummy areas between cell areas of one of the first and second substrates.

The present invention claims the benefit of Korean Patent ApplicationNo. P2002-8899 filed in Korea on Feb. 20, 2002, which is herebyincorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a manufacturing apparatus, and moreparticularly, to an apparatus for manufacturing a liquid crystal displaysuitable for a large-sized liquid crystal display.

2. Discussion of the Related Art

In general, recent developments in the information communication fieldhave increased demand for various types of displays devices. In responseto this demand, various flat panel type displays such as liquid crystaldisplay (LCD), plasma display panel (PDP), electro-luminescent display(ELD), and vacuum fluorescent display (VFD) have been developed toreplace conventional cathode ray tube (CRT) devices. In particular, LCDdevices have been used because of their high resolution, light weight,thin profile, and low power consumption. In addition, LCD devices havebeen implemented in mobile devices such as monitors for notebookcomputers. Furthermore, LCD devices have been developed for monitors ofcomputer and television to receive and display broadcasting signals.

Accordingly, efforts to improve image quality of LCD devices willcontrast with the benefits of high resolution, light weight, thinprofile, and low power consumption. In order to incorporate LCD devicesas a general image display, image quality such as fineness, brightness,large-sized area, for example, must be realized.

A plurality of gate lines are formed along one direction at fixedintervals on the first glass substrate (TFT array substrate), and aplurality of data lines are formed along a second directionperpendicular to one direction of the plurality of gate lines, therebydefining a plurality of pixel regions. Then, a plurality of pixelelectrodes are formed in a matrix arrangement at the pixel regions, anda plurality of thin film transistors (TFT) are formed at the pixelregions. Accordingly, the plurality of thin film transistors areswitched by signals transmitted along the gate lines and transfersignals transmitted along the data lines to each pixel electrode. Inorder to prevent light leakage, black matrix films are formed on thesecond glass substrate (color filter substrate) except at regions of thesecond glass substrate that correspond to the pixel regions of the firstglass substrate.

A process for manufacturing an LCD device using a TFT substrate and acolor filter substrate will be described with reference to amanufacturing apparatus according to the related art.

The process for manufacturing an LCD device according to the related artincludes steps of forming a sealant pattern on one of a first and secondsubstrate to form an injection inlet, bonding the first and secondsubstrates to each other within a vacuum processing chamber, andinjecting liquid crystal material through the injection inlet. Inanother process of manufacturing an LCD device according to the relatedart, a liquid crystal dropping method, which is disclosed in JapanesePatent Application No. 11-089612 and 11-172903, includes steps ofdropping liquid crystal material on a first substrate, arranging asecond substrate over the first substrate, and moving the first andsecond substrates, thereby bonding the first and second substrates toeach other. Compared to the liquid crystal injection method, the liquidcrystal dropping method is advantageous in that various steps such as,formation of a liquid crystal material injection inlet, injection of theliquid crystal material, and sealing of the injection inlet areunnecessary since the liquid crystal material is predisposed on thefirst substrate.

FIGS. 1 and 2 show cross sectional views of a substrate bonding deviceusing the liquid crystal dropping method according to the related art.In FIG. 1, the substrate bonding device includes a frame 10, an upperstage 21, a lower stage 22, a sealant dispensor (not shown), a liquidcrystal material dispensor 30, a processing chamber includes an upperchamber unit 31 and a lower chamber unit 32, a chamber moving system 40,and a stage moving system 50. The chamber moving system 40 includes adriving motor driven to selectively move the lower chamber unit 32 to alocation at which the bonding process is carried out, or to a locationat which outflow of the sealant occurs and dropping of the liquidcrystal material. The stage moving system 50 includes another drivingmotor driven to selectively move the upper stage 21 along a verticaldirection perpendicular to the upper and lower stages 21 and 22. Areceiving system temporarily receives a substrate 52 at oppositediagonal portions of the substrate 52. The receiving system is attachedto the upper stage 21, and includes a rotational axis 61 provided toextend from an exterior of the upper chamber unit 31 to an interior ofthe upper chamber unit 31, a rotational actuator 63 fixed to theexterior of the upper chamber unit 31 at one end of the rotational axis61 and driven to selectively rotate the rotational axis 61, an elevatingactuator 64 selectively elevating the rotational actuator 63, and areceiving plate 62 provided at the other end of the rotational axis 61to form a single body with the rotational axis 61, thereby selectivelysupporting opposite edge portions of the substrate 52.

A process of manufacturing a liquid crystal display device using thesubstrate assembly device according to the related art follows. First, asecond substrate 52 is loaded upon the upper stage 21, and a firstsubstrate 51 is loaded upon the lower stage 22. Then, the lower chamberunit 32 having the lower stage 22 is moved to a processing location (S1)by the chamber moving system 40 for sealant dispensing and liquidcrystal material dispensing. Subsequently, the lower chamber unit 32 ismoved to a processing location (S2) for substrate bonding by the chambermoving system 40. Thereafter, the upper and lower chamber units 31 and32 are assembled together by the chamber moving system 40 to form avacuum tight seal, and a pressure in the chamber is reduced by a vacuumgenerating system (not shown). The elevating actuator 64 is driven tomove the rotational axis 61 toward a lower part of the upper stage 21,and at the same time the rotational actuator 63 is driven to rotate therotational axis 61 so that the receiving plate 62 is positioned at bothedges of the second substrate 52 fixed to the upper stage 21.

FIGS. 2 and 3 show a perspective view of an operational state of areceiving system of a substrate assembly device according to a priorart. In FIGS. 2 and 3, when the stage moving system 50 moves the upperstage 21 downward in close corresponding to a height at which thereceiving plate 62 is positioned.

When a vacuum state is achieved inside the assembled chamber, the secondsubstrate 52 may fall from the upper stage 21 since the vacuum pressurewithin the chamber is larger than the vacuum force affixing the secondsubstrate 52 to the upper stages 21. Accordingly, before the desiredvacuum pressure within the chamber is achieved, it is necessary to keepthe second substrate 52 temporarily affixed to the upper stage 21. Oncethe desired vacuum pressure within the chamber part is attained, thesecond substrate 52 is affixed to the upper stage 21 by application anelectrostatic force to the upper stage 21. Accordingly, the receivingplates 62 and rotational axis 61 are returned to original standbylocations by driving the rotational actuator 63 of the receiving systemand the elevating actuator 64.

Then, the upper stage 21 is moved downward by the stage moving system 50to closely fasten the second substrate 52 affixed to the upper stage 21to the first substrate 51 affixed to the lower stage 22. In addition,the process for bonding the first and second substrates 51 and 52 toeach other is carried out through a continuous pressurization process,thereby completing the manufacture of LCD device.

However, the device of assembling substrates according to the prior artis disadvantages. First, the receiving system is constructed to supportonly the corner portions of the second substrate 52. Thus, a middleportion of the second substrate 52 may become curved downward.Specifically, if the receiving system according to the prior art isapplied to a manufacturing device for large-sized LCD device, thedeflection of the substrate is attenuated because a thickness of thelarge-sized LCD devices is relatively thin. Accordingly, the deflectionof the relatively thin substrate prevents the application of thereceiving system according to the prior art.

Second, an overall size of each receiving plate 62 is considerablysmaller than an overall size of the second substrate 52, therebyreducing contact areas between the second substrate 52 and the receivingplates 62. Furthermore, if the rotational axis 61 does not preciselyrotate due to malfunctions of the rotational actuator, the contact areasbetween the receiving plates 62 and the second substrate 52 becomeinsufficient to support the second substrate, thereby the secondsubstrate 52 may fall from the receiving plates 62. In addition, if thereceiving plates 62 according to the prior art are used to supportlarge-sized LCD devices, the receiving plates 62 will not provideadequate support for the larger substrates. Specifically, the contactareas of the receiving plates 62 are significantly smaller than anentire area of the larger substrate.

Third, the substrate assembly device according to the prior art has aninsufficient number of the receiving plates 62 to effectivelymanufacture large-sized LCD devices. Finally, as substrate models arereconfigured, dummy areas, at which the respective cell areas fail to beformed and which will be removed by ‘breaking’, are also changed. Thus,the receiving plates 62 according to the prior art cannot be revised inresponse to the reconfiguration of the substrate.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an apparatus andmethod for manufacturing a liquid crystal display device, a method forusing the apparatus, and a device produced by the method thatsubstantially obviates one or more problems due to limitations anddisadvantages of the related art.

An object of the present invention is to provide an apparatus and methodfor manufacturing a liquid crystal display device having a substratereceiving system that can prevent a specific portion of a targetsubstrate from being distorted, sufficiently support the overallsubstrate, and eliminate interference on operation of subsidiary deviceswith a structure supporting the substrate temporarily so as to preventthe substrate fixed to an upper stage during a process for achieving avacuum state inside a vacuum chamber in the process of a vacuum bondingof a liquid crystal display.

Additional features and advantages of the invention will be set forth inpart in the description which follows, and in part will become apparentfrom the description, or may be learned by practice of the invention.The objectives and other advantages of the invention will be realizedand attained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with thepurpose of the invention, as embodied and broadly described herein, anapparatus for vacuum bonding a liquid crystal display device includes aunitary vacuum processing chamber, upper and lower stages providedwithin the vacuum processing chamber for supporting first and secondsubstrates, and at least one first substrate receiving system providedwithin the vacuum processing chamber to contact dummy areas between cellareas of one of the first and second substrates.

In another aspect, a method manufacturing a liquid crystal displaydevice includes introducing first and second substrates into a unitaryvacuum processing chamber, loading the first and second substrates ontoupper and lower stages within the vacuum processing chamber, andcontacting dummy areas between cell areas of one of the first and secondsubstrates within the vacuum processing chamber.

In another aspect, a liquid crystal display device is manufactured by amethod of introducing first and second substrates into a unitary vacuumprocessing chamber, loading the first and second substrates onto upperand lower stages within the vacuum processing chamber, contacting dummyareas between cell areas of one of the first and second substrateswithin the vacuum processing chamber, and bonding the first and secondsubstrates together.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 shows a cross sectional view of a substrate bonding device priorto sealing of upper and lower chamber units according to the prior art;

FIG. 2 shows a cross section view of the substrate bonding device duringsubstrate bonding according to the prior art;

FIG. 3 shows a perspective view of an operational state of a receivingsystem of a substrate assembly device according to the prior art;

FIG. 4 is a cross-sectional view of an exemplary apparatus to which anexemplary substrate receiving system is applied according to the presentinvention;

FIG. 5A is a plane view of the exemplary substrate receiving systemalong I-I of FIG. 4 according to the present invention;

FIG. 5B is a plane view of another exemplary substrate receiving systemalong line I-I of FIG. 4 according to the present invention;

FIG. 6A is a cross sectional view of an exemplary operational state of asubstrate receiving system according to the present invention;

FIG. 6B is a cross sectional view of another exemplary operational stateof the substrate receiving system receiving a substrate in FIG. 4according to the present invention;

FIG. 7 is a plane view of an exemplary substrate receiving systemaccording to the present invention;

FIG. 8 is a plane view of an apparatus having another exemplarysubstrate receiving system;

FIG. 9 is a plane view of an apparatus having another exemplarysubstrate receiving system;

FIG. 10 is a cross sectional view of an exemplary substrate receivingsystem according to the present invention; and

FIG. 11 is a plane view of another exemplary substrate receiving systemaccording to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings.

FIGS. 4, 5A, 5B, 6A, and 6B illustrate an exemplary apparatus for vacuumbonding a liquid crystal display (LCD) device according to a firstembodiment of the present invention. In FIG. 4, the apparatus mayinclude a vacuum processing chamber 110, upper and lower stages 121 and122, a stage moving device, a vacuum device 200, a loader part 300, anda substrate receiving system 400.

The vacuum processing chamber 110 may be formed such that bondingbetween upper and lower substrates is selectively carried out in one ofa vacuum pressure state and an atmospheric pressure state within thevacuum processing chamber 110. To switch to the vacuum pressure statefrom an atmospheric pressure state, an air outlet 112 transfers a vacuumforce to an inner space of the vacuum processing chamber 110 via an airoutlet valve 112 a.

The upper and lower stages 121 and 122 may be provided at upper andlower spaces within the vacuum processing chamber 110, respectively. Theupper and lower stages 121 and 122 may receive first and secondsubstrates 510 and 520 that are loaded into the vacuum processingchamber 110 via the loading part 300. The upper and lower stages 121 and122 may each include an electrostatic chuck 121 a and 122 a for affixingthe second and first substrates 520 and 510, respectively, onto opposingsurfaces of the upper and lower stages 121 and 122. The upper stage 121may also include a plurality of vacuum holes 121 b formed along at leasta circumference of the upper stage 121, and interconnected via pipelines121 c to transmit a vacuum force generated by a vacuum pump 123 to affixthe second substrate 520 to a lower surface of the upper stage 121. Theplurality of vacuum holes 121 b may also be formed at a central portionof the upper substrate. Moreover, the lower stage 122 may also include aplurality of vacuum holes (not shown) formed along at least acircumference of the lower stage 122, and interconnected via pipelines(not shown) to transmit a vacuum force generated by a vacuum pump (notshown) to affix the first substrate 520 to an upper surface of the lowerstage 122.

The electrostatic chucks 121 a and 122 a may include at least one pairof electrostatic plates of opposing polarities to which a direct voltagehaving the different polarities is applied respectively so as to enablethe substrate to adhere thereto by an electrostatic force.Alternatively, the electrostatic force generated from the electrostaticchucks 121 a and 122 a may include at least one pair of electrostaticplates of similar polarities. In addition, the electrostatic chuck 122 amay be mounted at a top surface of the lower stage 122, and may includeat least one vacuum hole (not shown) provided along a circumference ofthe electrostatic chuck 122 a. Moreover, the electrostatic chuck 122 aand the at least one vacuum hole formed at the top surface of the lowerstage 122 is not limited to the same construction of the upper stage121. Preferably, the electrostatic chuck 122 a and the at least onevacuum hole at the top surface of the lower stage 122 are arranged so asto consider the overall shape of a target substrate, and the respectiveliquid crystal dispensing areas.

The stage moving device includes a moving axis 131 selectively driven tomove the upper stage 121, a rotational axis 132 selectively driven torotate the lower stage 122, and driving motors 133 and 134 coupledaxially with the upper and lower stages 121 and 122, respectively, atone of the exterior and interior of the vacuum processing chamber 110 todrive the axes, respectively. Accordingly, the stage moving device isnot limited to the device moving the upper stage 121 up and down or thelower stage 122 right and left. Preferably, the stage moving deviceenables movement of the upper stage 121 along a horizontal direction,and movement of the lower stage 122 along a vertical direction. Inaddition, a subsidiary rotational axis (not shown) may be incorporatedinto the upper stage 121 to enable rotation of the upper stages 121, anda subsidiary moving axis (not shown) may be incorporated into the lowerstage 122 to enable the vertical movement.

The loader part 300 may be arranged at the exterior of the vacuumprocessing chamber 110 separately from various elements provided insidethe vacuum processing chamber 110. The loader part 300 may include afirst arm 310 to carry the first substrate 510 upon which at least theliquid crystal material is disposed into the vacuum processing chamber110, and a second arm 320 to carry the second substrate 520 into thevacuum processing chamber 110. Alternatively, the first substrate 510may have both the liquid crystal material and the sealant disposed on asurface thereof, wherein the first substrate may be one of a TFT arraysubstrate and a color filter (C/F) substrate. The first arm 310 isdisposed over the second arm 320 so that contaminating particles fromthe second substrate 520 will not fall upon the first substrate 510.

The substrate receiving system 400 may contact a portion of the secondsubstrate 520 at dummy areas particularly located between cell areasformed on the second substrate 520. Each of the substrate receivingsystem 400 may include a rotational axis 410, a support 420, a supportprotrusion, and a driving part 430. The substrate receiving system 400may be provided at an interior bottom portion of the vacuum processingchamber 110 adjacent to sides of the lower stage 122. Accordingly, atotal number of the substrate receiving system 400 may be about 2 to 10.

FIGS. 5A and 5B are a plane views of the exemplary substrate receivingsystem along line I-I of FIG. 4 according to the present invention. InFIG. 5A, one end of the support 420 to which the rotational axis 410 iscoupled may be placed at the interior bottom portion of the vacuumprocessing chamber 110, which corresponds to a corner portion of one ofa long side and a short side of each of the upper and lower stages 121and 122. Specifically, the substrate receiving system 400 may beprovided at a vicinity of one corner portion or both corner portions ofone side of the lower stage 122 or at a vicinity of one corner portionor both corner portions of the other side of the lower stage 122. InFIG. 5B, one end of the support 420 to which the rotational axis 410 iscoupled may be placed at the interior bottom portion of the vacuumprocessing chamber 110, which corresponds to a middle portion of one ofa long side and a short side of each of the upper and lower stages 121and 122. Specifically, the substrate receiving system 400 may beprovided at a vicinity of a central portion of one or the other side ofthe lower stage 122, or may be provided at each corner and centralportions simultaneously. When the substrate receiving system 400 isprovided at the vicinity of the central portion of one side or the otherside of the lower stage 122, it is also possible to provide a pluralityof substrate receiving system 400.

In FIG. 5A, the supports 420 may be constructed of individual bodieseach having a first end attached at the rotational axis 410corresponding to a corner region of the lower stage 122, and a secondend having a support protrusion 420 a corresponding to a central regionof the lower stage 122. The supports 420 may be formed at a firstposition along a direction parallel to the long side of the upper andlower stages 121 and 122. During extension of the supports 420, each ofthe rotational axis 410 rotate the supports 420 from the first positionto a second position in which each of the support protrusions 420 a aredisposed at a region corresponding to one of the dummy areas.Alternatively, the supports 420 may be formed along a direction parallelto the short side of the upper and lower stages 121 and 122. However, itmay be preferable to provide the substrate receiving system 400 alongthe direction parallel to the long side of the upper and lower stages121 and 122 in order to provide sufficient margin space.

Each of the support protrusions 420 a may be formed at top portions ofthe supports 420 to reduce a contact area between the supports 420 andthe second substrate 520. The support protrusions 420 a are disposedalong the supports 420 such that when the support 420 is positionedunder the upper stage 121, the support protrusions 420 a contact thedummy areas of the second substrate 520. Each of the support protrusions420 a may have a same protruding height, or each of the supportprotrusions 420 a may have different relative heights. Moreover, each ofthe support protrusions 420 a may have individually adjustable heightsand each support 420 may have a plurality of at least one supportprotrusion 420 a. When at least two support protrusions 420 a are formedat a top surface of the support 420, an interval between the at leasttwo support protrusions 420 a may be selected to prevent a displacementof the second substrate 520. In addition, the interval between the atleast two support protrusions 420 a may be less than a correspondingdistance between adjacent cell areas such that the at least two supportprotrusions 420 a contact the second substrate with the dummy area.

Each of the driving parts 430 of the substrate receiving system 400 mayinclude a cylinder to provide a vertical movement of the rotational axis410 and a rotational motor 440 that rotates the rotational axis 410. Thecylinder may operate using a one, or both of hydraulic or pneumaticcontrol. Alternatively, the driving part 430 may include both thecylinder and the rotational motor 440, wherein the cylinder moves therotational axis 410 along a vertical plane and the rotational motor 440rotates the rotational axis 410 along a horizontal plane. Moreover, thecylinder may rotate the rotational axis 410 along the horizontal plane,and the rotational motor 440 may move the rotational axis 410 along thevertical plane.

During deployment of the substrate receiving system 400, the supports420 may be elevated from a home position to a first position along thevertical direction above an upper surface of the lower stage, and thusabove an upper surface of the first substrate 510, via one of thecylinder and rotational motor 440. Once the supports 420 have beenelevated above the upper surface of the first substrate 510, therotational motor 440 rotates the supports 420 about the rotational axis410 to a second position in which the support protrusions 420 a aredisposed adjacent to the dummy areas of the second substrate 520.Consideration must be given regarding the home position of the supports420. Specifically, the home position of the support 420 should bedetermined such that an upper surface of each of the support protrusions420 a should be lower than a top surface of the lower stage 122 toprevent any possible interference with a lower surface of the firstsubstrate 510. Furthermore, consideration should be given to the firstand second arms 310 and 320 of the loader part 300 such that thesubstrate receiving system 400 does not interfere with loading andunloading of the first and second substrates 510 and 520.

Each of the driving parts 430 may be disposed at the exterior of thevacuum processing chamber 110. Specifically, the rotational axis 410 maybe provided to penetrate the bottom portion of the vacuum processingchamber 110, and a sealing system (not shown) may be provided to preventair from entering into the vacuum processing chamber 110 during a vacuumpressure state.

A process for using the apparatus to bond substrates according to thepresent invention will now be explained with reference to FIGS. 4, 6A,and 6B.

In FIG. 4, a loading process is conducted wherein the loader part 300controls the first and second arms 310 and 320 to receive the first andsecond substrates 510 and 520. The first substrate 510 includes at leastthe liquid crystal material disposed on a first surface of the firstsubstrate 510. As previously explained, the first substrate 510 mayinclude both the liquid crystal material and the sealant, and the firstsubstrate 510 may include one of the TFT array substrate and the C/Fsubstrate. Once the first and second arms 310 and 320 retrieve the firstand second substrates 510 and 520, respectively. The loader part 300controls the second arm 320 to provide the second substrate 520 onto thelower surface of the upper stage 121. Accordingly, the vacuum pump 123provides the necessary vacuum force to the upper stage 122 to transferthe second substrate 520 from the second arm 320 to the lower surface ofthe upper stage 121. Thus, the second substrate 520 provided by thesecond arm 320 is affixed to the upper stage 121 by the vacuum forcegenerated by the vacuum pump 123.

During the loading process, if a bonding process of the first and secondsubstrates 510 and 520 has been previously performed, then the bondedsubstrates remain on the lower stage. Accordingly, the second arm 320may unload the bonded substrates remaining on the lower stage 122 afterloading the second substrate 520 onto the upper stage 121. Then, thebonded substrates may be removed from the vacuum processing chamber 110,and transferred to another processing step by the second arm 320,thereby shorten process time of the bonded substrates.

After the second arm 320 has transferred the bonded substrates, theloader part 300 controls the first arm 310 to provide the firstsubstrate 510 upon which at least the liquid crystal material isdisposed onto an upper surface of the lower stage 122. Accordingly, thevacuum pump (not shown) associated with the lower stage 122 provides thenecessary vacuum force to the lower stage 122 to transfer the firstsubstrate 510 from the first arm 510 to the upper surface of the lowerstage 122. Thus, the first substrate 510 provided by first arm 310 isaffixed to the lower stage 122 by the vacuum force generated by thevacuum pump (not shown) that is associated with the lower stage 122.After loading the first substrate 510 onto the lower stage 122, thefirst arm 310 of the loader part 300 exits the vacuum processing chamber110. Thus, the loading process is finished.

Once both of the first and second substrates 510 and 520 have beenloaded onto the upper and lower stages 121 and 122, respectively, theshield door 114 provided at the entrance 111 of the vacuum processingchamber 110 close the entrance 111. The shield door 114 provides for avacuum tight seal with the vacuum processing chamber 110.

Next, a vacuum process is started where the vacuum device 200 isactuated to generate a vacuum force while the switch valve 112 aprovided at the air outlet 112 of the vacuum processing chamber 110keeps the air outlet 112 open. The vacuum force generated by the vacuumdevice 200 is transferred to the interior of the vacuum processingchamber 110, thereby gradually reducing the pressure at the interior ofthe vacuum processing chamber 110.

During the vacuum process, a substrate receiving process is performedwherein the substrate receiving system 400 activates the cylinders androtational motors 440 to position the supports 420 beneath the lowersurface of the second substrate 520, as shown in FIG. 6A. Specifically,the support protrusions 420 a of each of the supports 420 are positionedadjacent to the dummy areas of the second substrate 520. Then, thevacuum pump 123 is disabled, thereby removing the vacuum force from theupper stage 121. Accordingly, the second substrate 520 falls from theupper stage 121 by release of the vacuum force, as shown in FIG. 6B, andthe lower surface of the second substrate 520 contacts each of thesupport protrusions 420 a of each of the supports 420. Alternatively,the supports 420 may be positioned such that the support protrusions 420a abut the lower surface of the second substrate 520. Accordingly, whenthe vacuum force is removed from the upper stage 121, the secondsubstrate 520 does not necessary fall from the upper stage 121, therebypreventing any damage to the second substrate 520 by contact to thesupport protrusions 420 a.

Meanwhile, once the vacuum pressure at the interior of the vacuumprocessing chamber 110 has been attained, the air outlet valve 112 a isenabled to close the air outlet 112, and the vacuum device 200 isstopped. However, the substrate receiving process may to be executedafter the vacuum process is completed, or prior to a start of the vacuumprocess. Alternatively, the substrate receiving process may be performedprior to the sealing of the vacuum processing chamber 110 by the shielddoor 114. Moreover, the substrate receiving process may begin once thesecond substrate 520 has been transferred onto the upper stage 121.

Once the vacuum process has been competed, an electrostatic process maybegin wherein the upper and lower stages 121 and 122 may apply anelectric power to the electrostatic chucks 121 a and 122 a,respectively, thereby electrostatically affixing the second and firstsubstrates 520 and 510 to the upper and lower stages 121 and 122,respectively. Then, the substrate receiving system 400 may be enabled toreturn the supports 420 to the home position.

Once the substrate receiving system 400 have returned to the homeposition, an alignment process may be performed to align the first andsecond substrates 510 and 520. The alignment process may include analignment system, wherein lateral and rotational adjustments of one orboth of the upper and lower stages 121 and 122 may be performed. Oncethe alignment process is completed, a bonding process wherein the upperand lower drive motors 133 and 134 may move one or both of the upper andlower stages 121 and 122 to bonding the first and second substrates 510and 520 together may be performed.

After completion of the bonding process, the vacuum pressure at theinterior of the vacuum processing chamber 110 may be decreased by avacuum release valve (not shown) that may be attached to the vacuumprocessing chamber 110. Then, once the pressure at the interior of thevacuum processing chamber 110 attains ambient atmospheric pressure, theshield door 114 of the vacuum processing chamber 110 may be driven toopen the entrance 111. Finally, the bonded substrates may be unloaded bythe second arm 320 of the loader part 300, and the loading process isstarted again.

FIGS. 7 and 8 are plane views of exemplary substrate receiving systemsaccording to the present invention. In FIG. 7, a first substratereceiving system 401 and a second substrate receiving system 402 may beincorporated into the apparatus according to the present invention. Thefirst substrate receiving system 401 may include a first rotational axis411, a first support 421, and a first support protrusion 421 a. Thesecond substrate receiving system 402 may include a second rotationalaxis 412, a second support 422, and a second support protrusion 422 a.The first support 421 of the first substrate receiving system 401 may beprovided near a middle portion or corner portion of the lower stage 121,and may be formed to be shorter than the second support 422 of thesecond substrate receiving system 402. The first substrate receivingsystem 401 may be provided closer to the lower stage 122 than the secondsubstrate receiving system 402. Accordingly, the first supports 421 ofadjacent first substrate receiving systems 401 are arranged along afirst line, and the second supports 422 of adjacent second substratereceiving systems 402 are arranged along a second line parallel to thefirst line. Moreover, each of the adjacent first substrate receivingsystems 401 and each of the adjacent second substrate systems 402 aresymmetrically disposed about the lower stage 121.

In FIG. 8, the first supports 421 at a first side of the lower stage 122are arranged along a first line, and the second supports 422 at thefirst side of the lower stage 122 are not arranged along a second line.Specifically, the second supports 422 at the first side of the lowerstage 122 are offset.

In FIGS. 7 and 8, the first rotational axis 411 of the first substratereceiving system 401 may be formed to be reciprocally offset to thesecond rotational axis 412 of the second substrate receiving system 402.In addition, the second rotational axis 412 may be formed to be closerto a short side of the lower stage 122 than the first rotational axis411, whereby the first and second rotational axes 411 and 412 enable areciprocal crossing operation. Accordingly, the reciprocal offsetprevents reciprocal interference by the rotation of the first support421 of the first substrate receiving system 401 and the second support422 of the second substrate receiving system 402. Moreover, a timingsequence of the first and second substrate receiving systems 401 and 402are different, thereby further preventing the reciprocal interference.

The first and second substrate receiving systems 401 and 402 arearranged at each corner of each long side of the lower stage 122 in adirection of the long side of the lower stage 122 so as to confront eachother. Accordingly, the first and second substrate receiving systems 401and 402 may be formed to cross each other. Furthermore, the first andsecond substrate receiving systems 401 and 402 may support the secondsubstrate so as not to pass the cell areas but to traverse the dummyarea in a straight line. The first and second substrate receivingsystems 401 and 402 may be provided at the long sides of the lower stage122, since the short sides of the lower stage 122 fail to providesufficient margin space. Thus, the first and second substrate receivingsystems 401 and 402 are provided at a vicinity of the long sides of thelower stage 122.

During the substrate receiving process, four of the second substratereceiving systems 402 operate to move to a work position, therebyenabling support of a specific portion of the second substrate 520.Specifically, the second rotational axes 412 of the four secondsubstrate receiving systems 402 move along an upward direction, and thenrotate in clockwise and counterclockwise directions to place each of thesecond supports 422 beneath the second substrate 520. Accordingly, thesecond support protrusions 422 a are positioned beneath the secondsubstrate 520 within the dummy areas of the second substrate 520.However, the substrate receiving process for the substrate receivingsystem of FIG. 8 must be performed in a slightly different sequence. InFIG. 8, the second rotational axes 412 at a first end of the lower stage122 must first be rotated in clockwise and counterclockwise directions,and the second rotational axes at a second end of the lower stage 122must be rotated next in clockwise and counterclockwise directions. Thus,the second supports 422 at the first end of the lower stage 122 do notinterfere with the second supports 422 at the second end of the lowerstage 122. Likewise, the sequence must be reversed when moving thesecond substrate receiving system 402 into the home position.

Then, the first rotational axes 411 of the four first substratereceiving systems 401 move upward, and rotate in a similar direction tothe second substrate receiving system 402 to position the secondsupports 422 to a work position, thereby enabling support of a specificportion of the second substrate 520. Specifically, the first rotationalaxes 411 of the four first substrate receiving systems 401 move along anupward direction, and then rotate in clockwise and counterclockwisedirections to place each of the first supports 421 beneath the secondsubstrate 520. Accordingly, the first support protrusions 421 a arepositioned beneath the second substrate 520 within the dummy areas ofthe second substrate 520.

During the previously described substrate receiving process, the vacuumforce transferred through the vacuum holes 121 b of the upper stage 121is released. Alternatively, the vacuum pressure at the interior of thevacuum processing chamber 110 may become higher than the vacuum forcetransferred through the vacuum holes 121 b of the upper stage 121.Accordingly, the second substrate 520 affixed to the upper stage 121falls along a gravitational direction to be placed on the first andsecond support protrusions 421 a and 422 a of the first and secondsubstrate receiving systems 401 and 402, respectively. Alternatively,the first and second support protrusions 421 a and 422 a may be placedto contact the lower surface of the second substrate 520 such that thesecond substrate 520 does not fall after the vacuum force applied by theupper stage 121 is released. Accordingly, any damage to the secondsubstrate 520 may be prevented.

Once the vacuum process has been competed, an electrostatic process maybegin wherein the upper and lower stages 121 and 122 may apply anelectric power to the electrostatic chucks 121 a and 122 a,respectively, thereby electrostatically affixing the second and firstsubstrates 520 and 510 to the upper and lower stages 121 and 122,respectively. Then, the first and substrate receiving systems 401 and402 may be enabled to return the first and second supports 421 and 422to the home position. Then, the alignment process and bonding processmay be carried out.

FIG. 9 is a plane view of an apparatus having another exemplarysubstrate receiving system. In FIG. 9, the second substrate receivingsystem 402 may be positioned closer to a central portion inside thevacuum processing chamber 110 (i.e., farther from an inner wall of thevacuum processing chamber 110) than the first substrate receiving system401.

In FIGS. 7, 8, and 9, lengths of the second supports 422 of the secondsubstrate receiving system 402 may be about 500˜1200 mm, and the firstsupports 421 of the first substrate receiving system 401 may be 100˜500mm. Preferably, the second supports 422 of the second substratereceiving system 402 is about 600 mm, and the first supports 421 of thefirst substrate receiving system 401 is about 400 mm. In general, thesecond supports 422 of the second substrate receiving system 402 may beat least longer than one-third of a long side of the second substrate520, and the first supports 421 of the first substrate receiving system401 may be at least longer than one-fifth of the lone side of the secondsubstrate 520. Accordingly, even if reciprocal operation between thefirst and second substrate receiving systems 401 and 402 are carried outsimultaneously, reciprocal interference fails to occur. Thus, a transittime of the first and second substrate receiving systems 401 and 402 isreduced and overall processing time is reduced.

The present invention is not limited to the first and second substratereceiving systems 401 and 402 being disposed at the interior bottomportion of the vacuum processing chamber 110. FIG. 10 is a crosssectional view of another exemplary substrate receiving system accordingto the present invention, and FIG. 11 is a plane view of anotherexemplary substrate receiving system according to the present invention.

In FIG. 10, an exemplary respective substrate receiving system may beprovided at an interior top portion of the vacuum processing chamber 110as well as an inner wall of the vacuum processing chamber 110, as shownin FIG. 11. Accordingly, if the substrate receiving system 400 accordingto the present invention is provided at the interior top portion of thevacuum processing chamber 110, an overall construction (i.e., positionsof the rotational axes 410 and supports 420 at the interior of thevacuum processing chamber 110) is similar of exemplary substratereceiving systems of FIGS. 7, 8, and 9. However, locations of thedriving parts of the substrate receiving system 400, locations of therotational axes 410 coupled axially with the driving parts, and thedownward movements of the rotational axes 410 are inverted. Moreover, ifthe substrate receiving system 400 is provided at the inner wall of thevacuum processing chamber 110, recesses 110 a corresponding to therespective supports may be formed at the interior wall of the vacuumprocessing chamber 110. The recesses 110 a allow the supports 420 to beinserted into the interior wall of the vacuum processing chamber 110,and the rotational axes 410 penetrate into the interior wall of thevacuum processing chamber 110 so a to be coupled axially with thedriving part provided at an exterior of the vacuum processing chamber110.

It will be apparent to those skilled in the art than variousmodifications and variations can be made in the apparatus and method formanufacturing liquid crystal display devices, method for using theapparatus, and device produced by the method of the present invention.Thus, it is intended that the present invention covers the modificationsand variations of this invention provided they come within the scope ofthe appended claims and their equivalents.

1-29. (canceled)
 30. A liquid crystal display device manufactured by amethod of: introducing first and second substrates into a unitary vacuumprocessing chamber; affixing the first and second substrates onto upperand lower stages within the vacuum processing chamber; contacting dummyareas between cell areas of one of the first and second substrateswithin the vacuum processing chamber; and bonding the first and secondsubstrates together.
 31. The device according to claim 30, wherein thestep of introducing first and second substrates includes first andsecond arms.
 32. The method according to claim 30, wherein the step ofaffixing the first and second substrates includes providing a vacuumforce to the upper and lower stages.
 33. The method according to claim30, wherein the step of affixing the first and second substratesincludes providing an electrostatic force to the upper and lower stages.34. The method according to claim 30, wherein the step contacting dummyareas includes a step of extending supports of a substrate receivingsystem beneath one of the first and second substrates.